Residual Contractive Stress and Thermal Expansibility of Polyvinylbutyral-Phenolic Resin Films
نویسندگان
چکیده
منابع مشابه
Residual stress evaluation in resin - molded
The high residual stress in a resin-molded electronic package sometimes makes the electronic functions unstable. Therefore the residual stress in electronic packages, especially on the top surfaces of semiconductor chips, should be evaluated. The objective of this study is to present a simple method for evaluating residual stress in resin-molded semiconductor chips using a combination of experi...
متن کاملpreparation and characterization of new co-fe and fe-mn nano catalysts using resol phenolic resin and response surface methodology study for fischer-tropsch synthesis
کاتالیزورهای co-fe-resol/sio2و fe-mn-resol/sio2 با استفاده از روش ساده و ارزان قیمت همرسوبی تهیه شدند. از رزین پلیمری resol در فرآیند تهیه کاتالیزور استفاده شد.
architecture and engineering of nanoscale sculptured thin films and determination of their properties
چکیده ندارد.
15 صفحه اولResidual stress analysis in thick uranium films
Residual stress analysis was performed on thick, 1–25 lm, depleted uranium (DU) films deposited on an Al substrate by magnetron sputtering. Two distinct characterization techniques were used to measure substrate curvature before and after deposition. Stress evaluation was performed using the Benabdi/Roche equation, which is based on beam theory of a bi-layer material. The residual stress evolut...
متن کاملResidual Stress Variation in Polysilicon Thin Films
This paper compares the use of four mechanical methods for characterization of residual stress variation in low pressure chemical vapor deposited (LPCVD) polysilicon thin films deposited, doped, and annealed under different conditions. Stress was determined using buckling structures, vibrating microstructures, static rotating structures and the wafer curvature method. After deposition of 1.0 μm...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Journal of the Japan Society of Colour Material
سال: 1958
ISSN: 0010-180X
DOI: 10.4011/shikizai1937.31.337